Barcelona Cybersecurity Congress (BCC) concludes a busy edition at the Gran Via venue in which it highlighted the importance of cybersecurity as a strategic priority in the business and industrial sectors to guarantee a more reliable digital environment. The BCC…
Clea’s integrates with Raspberry Pi to enable scalable Industrial IoT
SECO’s Clea is now readily available through Raspberry Pi OS – a development shared by Raspberry Pi that opens a new range of opportunities for industrial innovation. As highlighted on the official Raspberry Pi website, users can now connect to a Clea instance through a…
Myriota joins ETSI to support standardisation of NTN IoT satellite comms
Myriota announces that it has joined the European Telecommunication Standards Institute (ETSI). As an ETSI member, Myriota can now help 3GPP define products which add high quality ubiquitous satellite coverage to all cellular IoT markets. By embracing standards as part of…
Crypto Quantique announces QRoot Lite
Crypto Quantique has announced a new lightweight root-of-trust (RoT) IP block to enable security feature implementation in resource-constrained microcontrollers and IoT devices. Called QRoot Lite, the implementation complies to the Measurement and Attestation RootS of Trust (MARS) specification developed by…
CSignum secures £6M to transform underwater wireless networks
CSignum has completed a £6 million Series A funding round. The investment will accelerate growth of its EM-2 family of products which are transforming the way critical wireless sensor data is transmitted from submerged environments to networks above. The funding…
Distech Controls selects Insight SIP Bluetooth module for Resense Move
Building management is evolving into a more sophisticated process, balancing the dual priorities of enhancing occupant well-being and optimising energy efficiency. Resense Move by Distech Controls sets a new standard in achieving these objectives, delivering advanced sensing capabilities. Resense Move…
SICK launches the SIG300 IO-Link Master
SICK has announced the new SIG300 IO-Link Master for smart sensor integration, unlocking a wide range of possibilities for customers in automation. Special highlights include the integrated logic editor, which solves remote control tasks directly on the device, and the…
Hexagon’s Nexus: the platform powering smarter manufacturing
Hexagon’s connectivity and collaboration platform, Nexus, is rapidly gaining traction throughout the manufacturing value chain, providing its customers with powerful new productivity-boosting digitalisation, AI, and open integration experiences with Hexagon and third party platforms and data. Since its launch in…
Industry 4.0: the DACH region risks falling behind
According to the overall value of the MHP Industry 4.0 barometer, the degree of digitisation in industry is increasing worldwide, although not as quickly as before. China and the USA are continuing to extend their lead over the DACH region.…
Ulefone AI-driven rugged smartphones at MWC 2025
Ulefone has announced its return to the Mobile World Congress (MWC) 2025, taking place from March 3rd to March 6th in Barcelona, Spain. Under the theme ‘AI, Equip Your Armor’, Ulefone will showcase its next-generation rugged smartphones, combining robust designs…
